The A20 chip is likely to debut in the iPhone 18 Pro, and the folding phones by Apple will take advantage of a new packaging technique of TSMC 's 2nm chip fabrication technology.
The rumors about the iPhone 18 lineup are already in the breeze, even though we’ve yet to see the next lineup by Apple, that is iPhone 17 lineup. However, the future model by Apple could redesign the packaging.
What Do Analysts Say?
According to analyst of GF Securities Jeff Pu,” Apple should be using the A20 Chipset for the release of the iPhone 18 Pro, Pro Max, and iPhone Fold. This makes sense, as the A20 is two generations away from the 16 lineup by Apple’s A18 chip family.”
The comments made by Pu indicate two matters. The first one is that it could be using a 2-nanometer process.
The Current Chipset’s Specs
The second-generation 3-nanometer process is used by the current A18 chipset, which is referred to as N3E. The upcoming A19 chipset will use third-generation on N3P process. The A20 chipset uses the N2 process. This is also the first generation process. The die shrink might help the A20 be 15% faster than the A19.
It could be more efficient than its predecessor. It could use about 30% less power. This 2nm chipset was first rumored by Ming-Chi Kuo in March, he mentioned that all models from the 18 lineup will use the 2nm process. But again, in September 2024, he mentioned that only Pro models will use this 2nm process.
Package Designs of Chipset Will Be Used in iPhone 18 Pro
Reduced chip size will be beneficial as always. The new rumor about the new physical design of the chip indicates more benefits.
According to the latest leak, Apple will use TSMC’s new newWafer-Levell Multi-Chip Module (WLMCM). The new module indicates that the memory will be put straight onto the chip wafer.
The new chipset will increase the memory bandwidth and performance. Because of the new module, the memory will be closer to the CPU, GPU, and Neural Engine used by this new module chipset.
The changed packaging with shorter transit will provide benefits like hardware cooler and better battery life.
Now we have to wait for the ultimate announcement or the next possible leakouts about this new module. The news by Pu doesn’t necessarily provide anything new about the A20 chipset because these possible leaks were also rumored earlier by Ming-Chi Kuo.
